Product Engineering Intern - Spring 2022
As a technology leader, NXP is re-imagining how we connect and interact with our advanced portfolio of wireless solutions. Our in-house experts build on decades of leadership in RF technology to not only guide the ongoing expansion of wireless, but also innovate across the entirety of the wireless spectrum. From such short range technologies like NFC and Ultra-Wideband, to Wi-Fi 6 and 5G, the NXP team is driving global market adoption of these cutting-edge technologies.
NXP is uniquely positioned to enable smart connected devices for IoT, industrial, auto and communication infrastructure applications - making lives easier, safer, and more convenient.
Joining the NXP Wireless Connectivity team means you will have unparalleled opportunities to develop best in-class products with the latest IEEE standards in advanced processing nodes; it means you will work with a group of passionate and talented engineers to tackle the most crucial tasks leading the next-generation of innovations including Wi-Fi 7 technologies.
NXP’s Wireless Connectivity team has an open and inclusive work environment that promotes excellence, innovation, collaboration, and integrity. An expanding business comes with tremendous career opportunities which will challenge and grow your talents. If you are ready to start the next chapter of your career, don’t miss the opportunity to join a world leader in Wireless technology.
Job Summary:
- Looking for a motivated Product Engineer Intern to help with Read Point Automation analysis and reporting part of a System Level HTOL test on next generation Wi-Fi / Bluetooth and Narrowband PAs
- In this position, the candidate will help develop code to automate data analysis under the supervision and guidance of a Sr Product Engineer
- The candidate will be responsible for planning, development and implementation of the project
Key Challenges:
- Working on product qualification requires a strong understanding of the different Reliability failure mechanisms throughout the life of a semiconductor product. Working with Wi-Fi / Bluetooth and UWB combo SOCs requires some knowledge of the protocols and Receiver/Transmitter architectures in Wireless devices.
- Wireless testing can be a challenge as RF properties change across different materials, (walls, car bodies, metal objects, etc.) and the behavior changes in the presence of other RF signals, (interference) making it harder to control and troubleshoot.
Cross functional aspects:
- Working in the chip industry like NXP will expose you to software and all kinds of hardware resource experts
- The candidate will interface with other groups in the organization (i.e. Product Engineering, Test Engineering, & System Engineering) throughout the development of the project
- A Product Engineering position may not sound interesting at first but it’s the central point where you interface with many different teams in the organization to assess the manufacturability of a Design in high volume production with the highest quality and performance possible. This is a very exciting position to be in, helping in the development of a key Automation project while interfacing with many different groups in the organization will allow you to gain knowledge in many different areas
Job Qualifications:
- The candidate must be in the last year of a Bachelor of Science in EE or CS. MS preferred
- Basic understanding of analog circuit design, mixed signal and digital circuits required
· Knowledge of Wifi, BT, 15.4 and UWB standards a strong plus
· Knowledge of VBA, C, C++, R and/or Python a must
· Knowledge of statistical analysis concept a plus
· Strong analytical and interpersonal communication skills required
Job location:
Position is based in Irvine, CA and/or San Jose, CA. Student can be remote.